In the post-Moore era, the chiplet technology based on advanced packaging would be a quite promising solution for the high-performance AI chips. The chiplet technology with 2.5D/3D stacking package ...

Different from Chip on Wafer stacking technology, Wafer on Wafer (WoW) stacking can provide a tighter pitch and higher interconnect density with higher through-put. The difficulty for WoW stacking is ...