Longsys Launches 7.2mm Subsize eMMC, Breaking the Physical Space Constraints of AI Wearables
In the design of wearable devices, every millimeter matters. As AI technology becomes deeply integrated, wearable devices ...
Packaging Europe12h
DS Smith replaces EPS with corrugated cardboard in cold chain logistics
DS Smith presented a new fibre-based, temperature-controlled packaging solution at PharmaPack Europe 2025 - highlighting its ...