Longsys Launches 7.2mm Subsize eMMC, Breaking the Physical Space Constraints of AI Wearables
In the design of wearable devices, every millimeter matters. As AI technology becomes deeply integrated, wearable devices ...
Packaging Europe12h
DS Smith replaces EPS with corrugated cardboard in cold chain logistics
DS Smith presented a new fibre-based, temperature-controlled packaging solution at PharmaPack Europe 2025 - highlighting its ...
Semiconductor Engineering1d
Electrifying Everything: Power Moves Toward ICs
Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.
Packaging News1d
TomKat to move KoolPak operations to Thailand
Queensland-based start-up TomKat, the innovator behind KoolPak, the world-first reusable packaging solution for ...
Semiconductor Engineering4d
Liquid-Infused Nanostructured Composites As A Universal Thermal Interface Solution for Cooling Applications
A new technical paper titled “Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling” was published by researchers at Carnegie Mellon University ...
thecooldown4d
Revolutionary new tech solves major issue of a top packaging material: 'Companies and consumers can get all the benefits'
A new type of alternative styrofoam is available that will biodegrade without leaching microplastics into the environment.