In the design of wearable devices, every millimeter matters. As AI technology becomes deeply integrated, wearable devices ...

DS Smith presented a new fibre-based, temperature-controlled packaging solution at PharmaPack Europe 2025 - highlighting its ...

Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

Queensland-based start-up TomKat, the innovator behind KoolPak, the world-first reusable packaging solution for ...

A new type of alternative styrofoam is available that will biodegrade without leaching microplastics into the environment.

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

This will be an incredible year for innovation, driven by AI and for AI, and pushing the limits of fundamental physics.

Start looking through the best thermal cameras from handheld units to smartphone attachments. See the top standard and WiFi ...

Proven AI and HPC ASIC Design Flow Production-ready 3DIC cross-section Alchip’s newly available 3DIC design flow addresses ...

In response to plastic waste concerns in the logistics sector, 2nd Level Global Solutions has developed Solaris - a range of ...

New, grab-and-go solution from DGeo is designed specifically for first responders who need to mitigate lithium battery risks ...

SINGAPORE - Grand Venture Technology (GVT) and the Agency for Science, Technology and Research (A*Star) will be working ...