Jensen Huang, the CEO of Nvidia, is traveling to Beijing next week to present a modified version of the company’s Blackwell ...

Nvidia is set to begin production of a new, lower‐spec Blackwell‐architecture AI chip for the Chinese market as early as June ...

In aerospace applications, high-temperature shape memory alloys (HTSMAs)—materials capable of remembering and returning to ...

Abstract: We demonstrate the transmission of 144 (155) Gbaud PAM-4 (duobinary-PAM-4) and net 308 Gbps PAM-6 at 132 Gbaud in the C-band over 500 m of SSMF below the 6.7% overhead HD-FEC BER threshold ...

SiPearl, the company building European processors for supercomputing and AI, said it has “completed the conception” of the ...

Industry Support "New generation low-power memory LPDDR6 offers significant performance improvements," said Vice-chair of the JC-42.6 Low Power Memory Subcommittee and chair of th ...

Applied Materials AMAT is benefiting from rising demand for AI infrastructure, with its Logic and DRAM businesses gaining ...

The South Korean tech giant attributed its disappointing results to a combination of US export restrictions on advanced artificial intelligence chips bound for China and ongoing ...

Celebrate Prime Day with exclusive TerraMaster storage deals. From July 8 to 11, get up to 20% off on high-performance NAS ...

Micron Technology appears set for a bullish breakout as it rides a powerful wave of AI-driven demand ahead of its September ...

Hanmi Semiconductor has begun mass production of its thermal compression bonder (TCB) for HBM4, targeting the rapidly ...

NVIDIA currently secures its GDDR7 memory chips for its GeForce RTX 50 series GPUs from SK hynix and Samsung, but Micron is ...