Sondrel, a leading provider of ultra-complex custom chips, has announced that it has started front end, RTL design and ...

Frontgrade Gaisler has launched its latest radiation-hardened microcontroller, the GR716B. Building on the success of the ...

Traditional interconnects have been unable to deliver the bandwidth, latency, and power efficiency needs of hyperscale data ...

HBM implementation challenges This is the second in a three-part series from Alphawave Semi on HBM4 and gives insights into ...

TSMC is looking to introduce its A16 1.6nm process by the end of 2026 with an IEEE standard for its 3Dblox technology.

Designers of aerospace and defense systems know that their applications are mission-critical and demand the highest levels of ...

FlexNoC 5 interconnect IP with physical awareness improves place and route efficiency and reduces interconnect area and power ...

Cadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system ...

System Level Solutions Inc. (SLS) is revolutionizing high-speed data transfer with the world's first USB 20Gbps Device IP ...

MOUNTAIN VIEW, Calif., November 18, 2024 – Esperanto Technologies™, a leading developer of RISC-V chips and software for high ...

Xiphera’s board of five includes company’s co-founders and three other people from different backgrounds. The new board is filled with new kind of ...

This is the first of a three-part series from Alphawave Semi on HBM4 and gives an overview on the HBM standard. Part 2 will ...